Features & Benefits:
Process applicable to 100 mm, 150 mm and 200 mm wafers with minimum conversion time (less than 15 minutes)
Chemicals.
KOH.
HNO3.
/HF/CH₃COOH (HNA).
Continuous wafer rotation
Puddle mode
Dispense position and mode:
– Fix position
– Oscillating movement over a specific distance (wafer diameter).
Spray dispense.
Flush dispense.
Technical Specifications:
Available number of programs: 50.
Steps per program: 100.
Spin speed*: 1 – 10,000 rpm** ± 1rpm steps.
Spin speed accuracy: ± 0.1 rpm **.
Spin rotational direction : Clockwise, Counter clockwise.
Max. acceleration: 30,000 rpm/sec.
Acceleration accuray: ± 0.1 rpm/sec.
Spin speed read out accuray: ± 0.1 rpm.
System data
Interface: Keyboard and LCD full size display, chemical resistant, IP50.
Tank model: 2x NPP process tank, 10 L effective volume.
Utilities: DIW spray gun, N2 spray gun, vacuum wand, front light indicators.
Chamber diameter: 402 mm.
Dimension (desktop version): 1400 (w) x 1600 (h) x 950 (d) mm.
Safety : Leak sensor, drain sensor, ShutDown supply valve.
