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Andor’s USB 2.0 ikon-M SO series features high-QE, sensors for direct detection of soft X-Ray EUV or VUV photons. A convenient 16-point, knife-edge sealed 6” rotatable CF152 flange provides a robust and highly-effective seal to any compatible vacuum chamber interface.
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Features & Benefits:
Open front end – DN100CF / 6” CF / CF-152 flange and knife-edge sealing provided as standard for direct interfacing to vacuum chambers (rotatable design for iKon-M models).
1 MP and 4.2 MP sensor options – Choice of acquisition speed or large field-of-view to best match experimental needs.
13 x 13 µm pixel size – Ideal balance of dynamic range and resolution, on-head binning to extend dynamic range.
Peak QE of 95% – High photon collection efficiency for maximising signal-to-noise ratios. ‘Enhanced’ process back-illuminated sensor options for increased QE in the soft x-ray range.
Thermo-electric cooling down to -100°C – Efficiently minimizes dark current noise for acquisitions requiring longer sensor exposure time, obtain better signal-to-noise ratios faster.
Low noise readout down to 2.9 e- – Intelligent low-noise electronics offer the most ‘silent’ system noise.
Up to 5 MHz pixel readout speed – Slow readout for low noise and best SNR performance, faster speed for studying dynamic processes and 5 MHz focusing mode.
USB 2.0 interface – Built-in robust plug and play interface as standard.
Cropped sensor mode – Tracking stability to ensure all readout circuits experience same temperature and operating conditions.
Enhanced Baseline Clamp – Slower readout for lowest noise, faster speeds for more rapid readout and focusing.
Technical Specifications:
Pixels: 1024 X 1024.
Pixel size: 13 x 13 μm.
Image area : 13.3 x 13.3 mm with 100% fill factor.
Linearity: Better than 99%.
Frame rate: 4.4 fps.
Digitization: 16-bit (all speeds).
Output node capacity: 250,000 e-
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Our team is here to help you! Call us or leave us a message and an Apel Laser consultant will be happy to answer your questions and find personalized solutions for you.
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